IC Packaging Substrates: The Backbone of Integrated Circuits (Computers - Hardware)

Item ID 3060330 in Category: Computers - Hardware

IC Packaging Substrates: The Backbone of Integrated Circuits
Facilitated Circuit (IC) substrates are the foundation materials used in IC packaging substrates to get and work with relationship between the IC and the followed network on the PCB. These substrates consolidate different layers, a supporting community in the center, an association of drill openings, and guide pads, making them harder to deliver than standard PCBs. Contact info:- https://efpcb.wordpress.com/2024/10/30/ic-packaging-substrates-the-backbone-of-integrated-circuits/
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Target State: All States Target City : Shenzhen Last Update : 28 December 2024 7:11 PM Number of Views: 17	Item Owner : Shawn Wang Contact Email: Contact Phone: +86-755-23724206

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2025-01-03 (0.394 sec)