Semiconductor Die Bonding Equipment WFD16H (Shopping - Wholesale)
Item ID 3059320 in Category: Shopping - Wholesale
Semiconductor Die Bonding Equipment WFD16H | |
Features: 1. Develop high-precision controller 2. The first rotating platform + flying shooting function in China 3. Complex motion control algorithm cluster 4.Composite Vision System Specifications: 1. Position accuracy of standard piece/mass production piece after solidification: XY3um/5um 2. Angle accuracy after fixation: θ±0.3° 3. Single machine full test capacity: 1K/H 4. Compatible chip size: (0.16-6mm)*(0.16-6mm) 5. Compatible substrate size: (50mm-100mm)*(50mm-300mm) 6. Can handle 800G/400G/100G optical module mounting  | |
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| Target State: All States Target City : All Cities Last Update : 27 December 2024 12:43 PM Number of Views: 25 | Item Owner : exporter Contact Email: (None) Contact Phone: (None) |
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2025-01-05 (0.385 sec)