CSP Substrate Technology: Fundamentals and Applications (Computers - Hardware)

Item ID 3021415 in Category: Computers - Hardware

CSP Substrate Technology: Fundamentals and Applications
CSP substrate is one of the IC bundling advances that is utilized in the development of microelectronic frameworks. The size of the bundle depends on 1 and it very well may be a blend of parts of the number or just the initial segment. Twice the bite the dust size of the real kick the bucket with a solitary pass on bundle which has direct surface mounts capacity. It was first evolved during the 1990s because of huge necessities for little as well as productive bundles. Contact info:- https://efpcb.wordpress.com/2024/09/25/csp-substrate-technology-fundamentals-and-applications/
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Target State: All States Target City : Shenzhen Last Update : 05 November 2024 2:22 PM Number of Views: 38	Item Owner : Shawn Wang Contact Email: Contact Phone: +86-755-23724206

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2024-12-27 (0.417 sec)