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Item ID 2806867 in Category: Computers - Hardware

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CSP Substrate Technology: Fundamentals and Applications
CSP substrate is one of the IC bundling advancements that is utilized in the arrangement of microelectronic frameworks. The size of the bundle depends on 1 and it very well may be a mix of parts of the number or just the initial segment. Twice the pass on size of the real bite the dust with a solitary kick the bucket bundle which has direct surface mounts capacity. It was first evolved during the 1990s because of huge prerequisites for little as well as productive bundles. Contact info:- https://efpcb.wordpress.com/2024/09/25/csp-substrate-technology-fundamentals-and-applications/
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Target State: All States Target City : Shenzhen Last Update : 03 February 2025 3:26 PM Number of Views: 16	Item Owner : Shawn Wang Contact Email: Contact Phone: +86-755-23724206

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INNetAds > Computers > Hardware > Item ID 2806867

2025-02-05 (0.579 sec)